|
Core
Competencies: Components
The following is an account of various component
types that have been designed into projects listed within the “Core
Competencies: Projects” WebPages.
RF Domain
|
LNA, Log Amplifiers,
PIN diodes, Attenuators, Mixers, Modulators, VCO, OCXO, SAW filters, BALUN
transformers, Power splitters/combiners Power detectors, Circulators,
Isolators, Duplexors, Tuned cavity and Dielectric resonators, High Q
printed and wirewound Inductors, Ceramic/Porcelain MLC/SLC capacitors,
Shielding, Microstrip and differential impedance matching/PCB routing.
|
Analog
Domain
|
Transformers,
Op-amps, Comparators, Optical servo-isolators, Diodes, BJT, JFET, MOSFET,
HBT, HEMT, DIAC, TRIAC, SCR, Wirewound/printed inductors, PTC/NTC
thermistors, varistors, gas discharge tubes,
Film/ceramic/electrolytic/tantalum capacitors, Crystal resonators.
|
Digital
Domain
|
LS/ECL/CMOS type standard logic parts, SRAM, SDRAM,
DRAM, Dual-port RAM, CAM, FIFO, Flash, EPROM, Xilinx FPGA/PLDs, Altera
PLDs, Optical isolators
|
Mixed
Signal Domain
|
Conventional/Oversampled/Undersampled
ADC/DAC converters, a/u law CODEC.
|
Microprocessor/DSP
|
MPC8260, MPC860,
I960, MC68000, MC68302, ADSP21xx, TMS320C6211.
|
Sensors/Actuators
|
Solenoids, DC
motors, switches, thermal sensors, LED, LCD, Fibre optic transceivers,
optical proximity, Mono/Dipole/Parabolic/Corner/Patch Antenna.
|
Application
Specific
|
Switch mode
& linear regulators, SLICs, CODECs, framers, PLL, crosspoints, MODEMS,
Ethernet/DSx AFEs, HDLC/ISDN/CAS/IP/ATM link/protocol controllers.
|
Energy
Storage
|
Lead Acid/ NiCAD
batteries, SuperCAP.
|
Mechanical
|
Springs,
Injection Moulding, Mylar, EIA card cage and cabinet racking , fasteners.
|
|